Index: TODO
===================================================================
--- TODO	(revision 38443)
+++ TODO	(revision 38444)
@@ -84,7 +84,7 @@
 	- revise pad sizes and hole sizes, maybe starting from bedrock
 	- revise 3d (openscad) models if they still line up
 - BUG: start new layout: pcb-rnd foo.rp, export scad model, will export to foo.scad by default; then start new layout, save layout as bar.rp. When using export dialogue, dialogue defaults to previous filename foo.XXX for any of the export options. [report: Erich]
-- BUG: bbox used for subc boundary shouldn't include subc-aux vectors (maybe also should be the naked bbox) - this starts to matter bwloe 0805, where the vectors are larger than the fp [report: aron]
+- BUG: bbox used for subc boundary shouldn't include subc-aux vectors (maybe also should be the naked bbox) - this starts to matter below 0805, where the vectors are larger than the fp [report: aron]
 - poly lib rewrite:
 	- BUG: bug_files/TODO/out-extract*.rf, on which is not autocropped, triggers assert with scrolling, but the autocropped version does not. Polygon vertex coords are well under size limit for 32 bit coords in both cases. out-minimal.rf is a more minimal polygon version of the subc which triggers assert in footprint edit mode with {ze} and scroll bar use. [Report: Erich]
 	- BUG: thermal tool allows invalid polygon assert. might be a non bug. load bug_files/TODO/thermal-assert.rp and use thermal tool and shift click to start cycling through thermal types on padstack. Assert eventually occurs. [report: Erich]