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bedrock-rnd [bedrock-rnd logo]

bedrock-rnd parametric footprint

Input

  • draw grid in mm
  • draw in "mask and paste"

Result

Footprint attribute:
plcc-ipc(density=B,NL=5,NW=5,BL=0.350~0.356inch,BW=0.350~0.356inch,PP=0.050inch,PEL=0.385~0.395inch,PEW=0.385~0.395inch,PT=0.013~0.021inch,PC=0.080inch)

Download footprint file

 

Documentation

plcc-ipc(density=B,NL=5,NW=5,BL=0.350~0.356inch,BW=0.350~0.356inch,PP=0.050inch,PEL=0.385~0.395inch,PEW=0.385~0.395inch,PT=0.013~0.021inch,PC=0.080inch)

PLCC (J lead on four sides) using IPC from component drawing

Generate a PLCC (J lead on four sides) footprint from component drawing using IPC-7351 formulas and tables



plcc-ipc parameters

Ordered list (positions): density,NL,NW,BL,BW,PP,PEL,PEW,PT,PC,PG

name man
dat
ory		description value (bold: default)
density yes board density; C=high density, B=moderate density, A=general (low density)  
N yes total number of leads (square package)  
NL yes number of leads on one side along the length of the package (rectangular package)  
NW yes number of leads on one side along the width of the package (rectangular package)  
BS yes plastic body size (with tolernace; square package)  
BL yes plastic body length (with tolernace; rectangular package)  
BW yes plastic body width (with tolernace; rectangular package)  
PP yes nominal pitch (computed assuming no missing leads, so 6 or 8 leads)  
PE yes pin extent (with tolernace; square body)  
PEL yes pin extent along the length of the package (with tolernace; rectnagular body)  
PEW yes pin extent along the length of the package (with tolernace; rectnagular body)  
PT yes pin thickness (with tolernace); really the width of the lead  
PC yes pin contact length (with tolernace); specify either this or PG  
PG yes pin gap (with tolernace); specify either this or PC  
ECPL yes exposed center pad length (same direction as BL); 0 or empty if no exposed center pad  
ECPW yes exposed center pad width (same direction as BW); 0 or empty if no exposed center pad  
CPVP yes center pad via grid pitch (distance between vias); 0 or empty for no vias Dimension: a number with an optional unit (mm or mil, default is mil)
CPVHD yes center pad via hole diameter Dimension: a number with an optional unit (mm or mil, default is mil)
CPVCD yes center pad via copper diameter Dimension: a number with an optional unit (mm or mil, default is mil)
CPPAT yes center pad pattern type
none no pattern, round corner rectangle slightly smaller than the pad
chamfer small segments with chamfer corners that avoid vias
nopaste no paste at all
CPPG yes center pad pattern gap; nominal distance between pattern elements Dimension: a number with an optional unit (mm or mil, default is mil)
datasheet   url to the datasheet dimensions are coming from  
F yes fab tolerance in +-mm  
P yes part placement tolerance in +-mm  
silk_thickness yes thickness of silk graphic lines; diametr of pin 1 dot is calculated from this too  
mask_offs yes gap between copper pad edge and mask cutout edge  
glue_thick yes default line thickness for glue on adhesive layers; if 0 omit the layer  
glue_dots yes print dots instead of lines for glue when non-zero  
pad_rounding   rectangular pad corner rounding radius (0 for sharp corners) Dimension: a number with an optional unit (mm or mil, default is mil)