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bedrock-rnd [bedrock-rnd logo]

bedrock-rnd parametric footprint

Input

  • draw grid in mm
  • draw in "mask and paste"

Result

Footprint attribute:
sot23-ipc(density=C, N=3, BL=2.8~3.0, BW=1.2~1.4, PP=0.95, PE=2.1~2.5, PT=0.38~0.48, PC=0.15~0.45)

Download footprint file

 

Documentation

sot23-ipc(density=C, N=3, BL=2.8~3.0, BW=1.2~1.4, PP=0.95, PE=2.1~2.5, PT=0.38~0.48, PC=0.15~0.45)

sot23 using IPC from component drawing

Generate a sot23 footprint from component drawing using IPC-7351 formulas and tables

sot23-ipc parameters

Ordered list (positions): density,N,BL,BW,PP,PE,PT,PC,PG

name man
dat
ory		description value (bold: default)
density yes board density; C=high density, B=moderate density, A=general (low density)  
N yes number of leads
3
4
5
6
8
BL yes plastic body length (with tolernace)  
BW yes plastic body width (with tolernace)  
PP yes nominal pitch (computed assuming no missing leads, so 6 or 8 leads)  
PE yes pin extent (with tolernace)  
PT yes pin thickness (with tolernace); really the width of the lead  
PC yes pin contact length (with tolernace); specify either this or PG  
PG yes pin gap (with tolernace); specify either this or PC  
datasheet   url to the datasheet dimensions are coming from  
F yes fab tolerance in +-mm  
P yes part placement tolerance in +-mm  
silk_thickness yes thickness of silk graphic lines; diametr of pin 1 dot is calculated from this too  
mask_offs yes gap between copper pad edge and mask cutout edge  
glue_thick yes default line thickness for glue on adhesive layers; if 0 omit the layer  
glue_dots yes print dots instead of lines for glue when non-zero  
pad_rounding   rectangular pad corner rounding radius (0 for sharp corners) Dimension: a number with an optional unit (mm or mil, default is mil)